Penanos™LLC Technology

Penanos™ LLC is in a Technology Research Development/Trial Stage that holds a Provisional Patent Application in the U.S. for the development of Printed Electronics - PE “e-MEM” Processes.

Penanos™ creates a “Channel Seam’ in either a Single “Panel” or a Multiple “Panel” in a Uniform Conductive/Interconnected Composite Seam Platform during the manufacturing process.

PE – Printed Electronics “e-MEM” -Membrane Film or an FE – Flexible Electronics Fabric in an “Active Surface” Humidity/Moisture Management and “Active Surface Pulse” Anti-Viral Management Platforms, inclusive of a combination of both “Active Surface” Components.

Penanos™ System is also available as a PE/FE “e-CIP” Circuit/Sensor Controller Component(s) in an EIM - Embedded Interface Module or as a RIM - Removable Interface Module design.

PE “e-MEM” - Membrane Film “Active Surface” & “Active Surface Pulse” Technology Applications.